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Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks

There are 8 key differences between Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks.

Key differences

Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks — Key differences
Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
Fabrication Not officially confirmed (independent estimates range from advanced 7nm to 5nm from SMIC) 4 nm (TSMC N4P)
Announced 20 April 2026 (with the launch of Huawei Pura 90 Pro andPro Max) 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro
CPU cores 8 cores (some sources cite 12 logical threads via SMT, not officially confirmed) 8 cores
Core configuration 1× Taishan Big clocked above 3.0 GHz + 3× Taishan Mid at ~2.27 GHz + 4× Taishan Little at ~1.72 GHz 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores
Max clock ~3.0 GHz 3.4 GHz
Architecture ARMv8-A, 64-bit (Huawei's own core design) ARMv9.2-A, 64-bit
GPU Maleoon 920 (some less consistent sources cite the Maleoon 935; not officially confirmed) Mali-G720 MC8
GPU clock Not officially announced ~1300–1500 MHz (slight variation between sources)

Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks

A chip that reflects real progress in Huawei's technical independence, with a clear focus on AI imaging improvements and unique satellite connectivity. The lack of full official transparency means final performance should be judged cautiously until more reliable data is available.

  • +A real, officially stated improvement in AI image processing
  • +Two-way Beidou satellite connectivity — a world exclusive
  • +CPU performance approaching Snapdragon 8 Gen 3 level
  • No full official transparency on the CPU and GPU details
  • Independent sources clearly disagree on the exact GPU name
  • Performance still well short of the newest global flagship chips in 2026
Read the full review →

MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks

A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.

  • +An all-big-core design that delivers very strong processing performance
  • +Top-tier LPDDR5X memory and UFS 4.1 storage
  • +Advanced generative AI support via the NPU 880
  • Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
  • Less consistent performance during long gaming sessions
  • Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
Read the full review →

Full specifications

Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks — Full specifications
Huawei Kirin 9030S Chipset Review — Specifications and Benchmarks MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
التصنيع
Manufacturer MediaTek
Fabrication Not officially confirmed (independent estimates range from advanced 7nm to 5nm from SMIC) 4 nm (TSMC N4P)
Announced 20 April 2026 (with the launch of Huawei Pura 90 Pro andPro Max) 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro
Availability Available Available
المعالج المركزي
CPU cores 8 cores (some sources cite 12 logical threads via SMT, not officially confirmed) 8 cores
Core configuration 1× Taishan Big clocked above 3.0 GHz + 3× Taishan Mid at ~2.27 GHz + 4× Taishan Little at ~1.72 GHz 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores
Max clock ~3.0 GHz 3.4 GHz
Architecture ARMv8-A, 64-bit (Huawei's own core design) ARMv9.2-A, 64-bit
الرسوميات والذكاء الاصطناعي
GPU Maleoon 920 (some less consistent sources cite the Maleoon 935; not officially confirmed) Mali-G720 MC8
GPU clock Not officially announced ~1300–1500 MHz (slight variation between sources)
NPU A new, improved NPU — 200% better image understanding than the Kirin 9020 (officially announced by Huawei) MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation)
AI performance Not officially announced by Huawei No specific figure announced by MediaTek
الذاكرة والاتصال
Supported RAM No exact official figure (supports up to 16 GB per some sources) LPDDR5X
Max RAM Not officially announced Up to 9600 Mbps
Supported storage Not precisely announced UFS 4.1
Modem Integrated 5G, theoretical download up to 3,500 Mbps (some less reliable sources cite higher figures under the "5.5G" label) Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation
5G Yes Yes
Wi-Fi Wi-Fi 7 Wi-Fi 6E
Bluetooth 6.0 (depending on the actual device's specifications) 5.4
نتائج الاختبارات
AnTuTu ~1,614,887 ~2,136,906
Geekbench single-core ~1,411 ~1,708 – 1,725
Geekbench multi-core ~4,121 ~6,297 – 6,860
مميزات إضافية
Key features 43% better AI colour processing, 110% clearer zoomed video, 30% steadier frame rates in games, 25% better overall performance versus the Pura 80 generation, plus Beidou satellite connectivity Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving
Phones using it Huawei Pura 90 Pro, Huawei Pura 90 Pro Max Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5

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