Qayimli
ميديا تيك (MediaTek)

MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks

7.5 Our score
out of 10
Fabrication: 4 nm (TSMC N4P)
Cores: 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores
GPU: Mali-G720 MC8
AnTuTu: ~2,136,906
Modem: Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation

The "Dimensity 8500 Ultra" is one of several releases of the same base Dimensity 8500 platform (announced on 15 January 2026). MediaTek issued multiple names for the same underlying design depending on the manufacturing partner: the standard "Dimensity 8500" (in the Honor Power 2), "Ultra" (in the global Poco X8 Pro) and "Extreme" in other models.

The differences between these releases are very small, limited to slight variations in benchmark results (most likely down to chip binning rather than an architectural change), while the core layout and GPU are practically identical across all of them.

That marketing distinction deserves spelling out, so no reader assumes "Ultra" is fundamentally stronger than the base version.

Performance: a bold all-big-core design

The chip continues the "All Big Core" philosophy MediaTek began with the Dimensity 8400: eight architecturally identical Cortex-A725 cores at staggered clocks — one prime core at 3.4 GHz, three performance cores at 3.2 GHz and four more at 2.2 GHz, with no traditional efficiency cores (Cortex-A5xx) at all.

That represents roughly a 7% improvement over the previous generation (Dimensity 8400), according to MediaTek.

Actual results: about 2,136,906 points in AnTuTu (the Ultra specifically, in the Poco X8 Pro), roughly 1,708–1,725 in single-core Geekbench and between 6,297 and 6,860 in multi-core depending on the device, storage and memory.

Those numbers put the chip in direct, serious competition with the Snapdragon 8s Gen 4, especially in multi-core — although Qualcomm's rival leads it by about 13% in CPU and 23% in graphics per independent tests.

GPU: real progress, still behind the direct rival

The chip uses a Mali-G720 MC8 (an upgrade over the MC7 in the Dimensity 8400), clocked at up to 1300–1500 MHz depending on the source, with hardware-accelerated ray tracing.

MediaTek claims 25% higher peak performance and 20% lower power draw than the previous generation.

Direct comparisons with the Snapdragon 8s Gen 4, however, showed Qualcomm's rival clearly ahead in stability across long sessions and frame-rate consistency under sustained load.

AI: a clear focus on generative intelligence

The chip carries the advanced NPU 880, with mixed-precision INT4 quantisation and on-device generative AI capabilities including live translation and image generation, plus compatibility with MediaTek's Dimensity AI Development Kit and the major global language models.

Memory and storage: strong specifications for the price

The chip supports LPDDR5X memory at up to 9600 Mbps (up to 12% more bandwidth than the previous generation) with UFS 4.1 storage, as seen in the actual Poco X8 Pro specifications — very strong for the upper mid-range price tier, approaching flagship level.

Connectivity: the one noticeable weakness

The chip supports 5G-Advanced with theoretical download speeds up to 5.17 Gbps, triple carrier aggregation and dual-standby dual 5G SIM. On short-range wireless, though, it tops out at Wi-Fi 6E and Bluetooth 5.4, while its direct rival the Snapdragon 8s Gen 4 offers newer standards (Wi-Fi 7 and Bluetooth 6.0) — worth weighing for anyone after longer future-proofing.

Camera: a strong, clearly specified image processor

The chip relies on the Imagiq 1080 image processor with AI Zero Shutter Lag, 4K HDR video support and semantic segmentation for automatic image-quality improvement.

Verdict

The Dimensity 8500 Ultra is a strong continuation of MediaTek's all-big-core philosophy, with excellent multi-threaded CPU performance and top-tier memory/storage for its price class.

But it is not a complete rival to the Snapdragon 8s Gen 4 in graphics performance and stability, nor in the newest wireless standards.

It remains an excellent choice for strong processing performance and fast storage at a reasonable price — but the heaviest gamers, and anyone wanting longer connectivity future-proofing, may prefer the Qualcomm alternative.

✅ Pros

  • +An all-big-core design that delivers very strong processing performance
  • +Top-tier LPDDR5X memory and UFS 4.1 storage
  • +Advanced generative AI support via the NPU 880
  • +A strong image processor with zero shutter lag and 4K HDR capture
  • +Excellent 5G speeds of up to 5.17 Gbps

❌ Cons

  • Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
  • Less consistent performance during long gaming sessions
  • Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
  • The number of variant names (Ultra/Extreme/Max) can confuse buyers

Frequently asked questions

What is the difference between the Dimensity 8500 and the 8500 Ultra?
No fundamental architectural difference — both use the same core layout and GPU. The small benchmark gaps most likely come down to chip binning rather than a different design.
How does this chip compare with the Snapdragon 8s Gen 4?
The Snapdragon 8s Gen 4 leads by about 13% in CPU and 23% in GPU performance in independent tests, but the Dimensity 8500 Ultra offers higher theoretical 5G speeds and a memory/storage combination at roughly the same level.
Does the chip support Wi-Fi 7?
No — it tops out at Wi-Fi 6E and Bluetooth 5.4, less current than some direct rivals in the same price class.
What memory and storage does it support?
LPDDR5X memory at up to 9600 Mbps and fast UFS 4.1 storage — very strong specifications for the upper-mid-range class.
Which phones use the Dimensity 8500 Ultra specifically?
It debuted in the global Poco X8 Pro, while other devices such as the Honor Power 2 and Redmi Turbo 5 use the base "Dimensity 8500" version of the same platform.
7.5

Quick verdict

A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.

التصنيع
Manufacturer MediaTek
Fabrication 4 nm (TSMC N4P)
Announced 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro
Availability Available
المعالج المركزي
CPU cores 8 cores
Core configuration 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores
Max clock 3.4 GHz
Architecture ARMv9.2-A, 64-bit
الرسوميات والذكاء الاصطناعي
GPU Mali-G720 MC8
GPU clock ~1300–1500 MHz (slight variation between sources)
NPU MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation)
AI performance No specific figure announced by MediaTek
الذاكرة والاتصال
Supported RAM LPDDR5X
Max RAM Up to 9600 Mbps
Supported storage UFS 4.1
Modem Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation
5G Yes
Wi-Fi Wi-Fi 6E
Bluetooth 5.4
نتائج الاختبارات
AnTuTu ~2,136,906
Geekbench single-core ~1,708 – 1,725
Geekbench multi-core ~6,297 – 6,860
مميزات إضافية
Key features Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving
Phones using it Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5

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