MediaTek Dimensity 7300-Energy Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
There are 7 key differences between MediaTek Dimensity 7300-Energy Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks.
Key differences
| MediaTek Dimensity 7300-Energy Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Fabrication | 4nm | 4 nm (TSMC) |
| Announced | July 2024 | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) |
| Core configuration | 4x Cortex-A78 2.5GHz + 4x Cortex-A55 2.0GHz | 4× Cortex-A78 + 4× Cortex-A55 |
| Max clock | 2.5 GHz | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed |
| AnTuTu | Approximately 739,000 | ~983,589 |
| Key features | Focus on power efficiency and longer battery life | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video |
| Phones using it | Oppo Reno16 F | Realme 16 Pro 5G (January 2026) |
MediaTek Dimensity 7300-Energy Chipset Review — Specifications and Benchmarks
The Dimensity 7300-Energy focuses on power efficiency and longer battery life, making it a strong fit for phones with massive batteries.
- +Excellent power efficiency supports massive batteries.
- +Balanced performance for daily use and medium gaming.
- +Relatively modern 4nm process.
- −Moderate performance that doesn't compete with flagship-tier chips.
- −May be confused with the standard Dimensity 7300 naming.
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.
- +Excellent power efficiency thanks to the 4nm process
- +UFS 3.1 storage support instead of UFS 2.2
- +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
- −Still on LPDDR4X memory rather than LPDDR5X
- −Limited graphics performance in demanding games
- −The real-world gap to the standard Dimensity 7300 is unclear in everyday use
Full specifications
| MediaTek Dimensity 7300-Energy Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | MediaTek | MediaTek |
| Fabrication | 4nm | 4 nm (TSMC) |
| Announced | July 2024 | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) |
| Availability | Available | Available |
| CPU | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 4x Cortex-A78 2.5GHz + 4x Cortex-A55 2.0GHz | 4× Cortex-A78 + 4× Cortex-A55 |
| Max clock | 2.5 GHz | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed |
| Architecture | — | ARMv8.2-A, 64-bit |
| Graphics & AI | ||
| GPU | — | Mali-G615 MC2 |
| GPU clock | — | No specific official figure from MediaTek |
| NPU | — | MediaTek APU 655 |
| AI performance | — | No specific figure announced by the company |
| Memory & connectivity | ||
| Supported RAM | — | LPDDR4X |
| Max RAM | — | No exact official figure |
| Supported storage | — | UFS 3.1 |
| Modem | — | Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps |
| 5G | Yes | Yes |
| Wi-Fi | — | Wi-Fi 6 |
| Bluetooth | — | 5.4 |
| Benchmarks | ||
| AnTuTu | Approximately 739,000 | ~983,589 |
| Geekbench single-core | — | ~998 – 1003 |
| Geekbench multi-core | — | ~2869 – 2881 |
| Extra features | ||
| Key features | Focus on power efficiency and longer battery life | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video |
| Phones using it | Oppo Reno16 F | Realme 16 Pro 5G (January 2026) |
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