MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
out of 10
The Dimensity 7300 Max is a modified version of the successful Dimensity 7300 family MediaTek launched in mid-2024, and this specific version debuted with the Realme 16 Pro in January 2026. Unlike the "Turbo" case we saw earlier, the "Max" name has some real justification: some reviews point to a slight bump in the big cores' maximum clock (up to 2.8 GHz per some sources, versus 2.5 GHz on the standard version). Most other technical databases (GSMArena, Mobolist, Geekbench) still list it at the same 2.5 GHz, however, so the actual difference is not 100% confirmed and deserves caution.
Performance: dependable continuity, not a leap
The chip keeps the same core structure as the 7300 family: four Cortex-A78 cores at up to 2.5 (or 2.8, depending on the source) GHz for heavy tasks and four Cortex-A55 cores at 2.0 GHz for light work, fabricated on TSMC's 4nm process. That gives it excellent power efficiency next to rivals built on 6nm.
Actual benchmark results: about 983,000 points in AnTuTu (per 91mobiles testing), roughly 998–1,003 in single-core Geekbench 6 and 2,869–2,881 in multi-core. Genuinely strong numbers for its target price class, approaching some previous-generation Snapdragon 7 chips — though some reviews (such as Hitech Century) noted the "Max" performed almost identically to the earlier Dimensity 7300+ with no real, felt leap in everyday use.
GPU: efficiency before raw power
The chip uses a Mali-G615 MC2 — the same unit as the base 7300. It runs games such as Genshin Impact acceptably at default settings, but it is not built for the heaviest titles at maximum graphics. The chip achieves excellent thermal consistency (about 99% stability in long tests), but its graphics ceiling stays limited next to rivals in the same upper price band.
Memory and storage: a tangible improvement
A real strength here: the chip supports UFS 3.1 storage (a jump over the UFS 2.2 common in MediaTek's budget chips), although the RAM is still LPDDR4X rather than the LPDDR5X the "Max" name might suggest. The combination makes everyday app-launching and file transfers smooth, without reaching true flagship levels.
Connectivity: a complete, modern set
The chip fully supports 5G with dual 5G SIM and carrier aggregation, with theoretical download speeds up to 3.27 Gbps. More importantly, the devices carrying it (such as the Realme 16 Pro) ship with Wi-Fi 6 and Bluetooth 5.4 — a modern connectivity set that suits the upper mid-range price tier the phone targets.
Verdict
The Dimensity 7300 Max is a real — if modest — improvement on the successful Dimensity 7300 family, with tangible gains in storage (UFS 3.1) and connectivity (Wi-Fi 6, Bluetooth 5.4), while the CPU clock bump remains disputed between sources. The practical upshot: a dependable, efficient chip for everyday use and light to mid-weight gaming — not a raw-performance monster, and one that competes with bigger names more through overall design balance than through CPU muscle alone.
✅ Pros
- +Excellent power efficiency thanks to the 4nm process
- +UFS 3.1 storage support instead of UFS 2.2
- +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
- +Excellent thermal stability under prolonged use
- +Camera support up to 200MP
❌ Cons
- −Still on LPDDR4X memory rather than LPDDR5X
- −Limited graphics performance in demanding games
- −The real-world gap to the standard Dimensity 7300 is unclear in everyday use
- −The maximum clock is unconfirmed — sources disagree between 2.5 and 2.8 GHz
Frequently asked questions
What is the difference between the Dimensity 7300 Max and the standard 7300?
Does the Dimensity 7300 Max support 5G?
Is this chip good for gaming?
What RAM and storage does it support?
Which phones use the Dimensity 7300 Max?
Quick verdict
A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.
| التصنيع | |
| Manufacturer | MediaTek |
|---|---|
| Fabrication | 4 nm (TSMC) |
| Announced | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) |
| Availability | Available |
| المعالج المركزي | |
| CPU cores | 8 cores |
|---|---|
| Core configuration | 4× Cortex-A78 + 4× Cortex-A55 |
| Max clock | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed |
| Architecture | ARMv8.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | |
| GPU | Mali-G615 MC2 |
|---|---|
| GPU clock | No specific official figure from MediaTek |
| NPU | MediaTek APU 655 |
| AI performance | No specific figure announced by the company |
| الذاكرة والاتصال | |
| Supported RAM | LPDDR4X |
|---|---|
| Max RAM | No exact official figure |
| Supported storage | UFS 3.1 |
| Modem | Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps |
| 5G | Yes |
| Wi-Fi | Wi-Fi 6 |
| Bluetooth | 5.4 |
| نتائج الاختبارات | |
| AnTuTu | ~983,589 |
|---|---|
| Geekbench single-core | ~998 – 1003 |
| Geekbench multi-core | ~2869 – 2881 |
| مميزات إضافية | |
| Key features | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video |
|---|---|
| Phones using it | Realme 16 Pro 5G (January 2026) |
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