Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
There are 8 key differences between Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks.
Key differences
| Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | HiSilicon (a Huawei subsidiary) | MediaTek |
| Fabrication | 7 nm (SMIC N+2) | 4 nm (TSMC) |
| Announced | Leaked December 2023 — officially launched October 2024 | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) |
| Core configuration | 1× Cortex-A77 at 2.4GHz + 3× Cortex-A77 at 2.19GHz + 4× Cortex-A55 at 1.84GHz | 4× Cortex-A78 + 4× Cortex-A55 |
| Max clock | 2.4 GHz | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed |
| GPU | Mali-G610 MC3 at 864 MHz | Mali-G615 MC2 |
| GPU clock | 864 MHz | No specific official figure from MediaTek |
| NPU | Not officially documented in detail | MediaTek APU 655 |
Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks
The Kirin 8000 is a chip suited to everyday use — browsing, social media, camera — inside Huawei's mid-priced phones. It does not target gamers or anyone after flagship-level performance, largely because of the ongoing manufacturing restrictions on Huawei.
- +Large battery with good endurance
- +Smooth day-to-day performance thanks to HarmonyOS and Ark Engine optimisations
- +Modern 5G and Wi-Fi (6 or 7 depending on the model)
- −Still stuck on a 7nm process because of US sanctions
- −Relatively dated core architecture (Cortex-A77/A55) next to rivals such as the Dimensity 7000 series or newer Snapdragon 7 chips
- −Not enough official transparency on the NPU and its AI capabilities
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.
- +Excellent power efficiency thanks to the 4nm process
- +UFS 3.1 storage support instead of UFS 2.2
- +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
- −Still on LPDDR4X memory rather than LPDDR5X
- −Limited graphics performance in demanding games
- −The real-world gap to the standard Dimensity 7300 is unclear in everyday use
Full specifications
| Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| التصنيع | ||
| Manufacturer | HiSilicon (a Huawei subsidiary) | MediaTek |
| Fabrication | 7 nm (SMIC N+2) | 4 nm (TSMC) |
| Announced | Leaked December 2023 — officially launched October 2024 | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) |
| Availability | Available | Available |
| المعالج المركزي | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 1× Cortex-A77 at 2.4GHz + 3× Cortex-A77 at 2.19GHz + 4× Cortex-A55 at 1.84GHz | 4× Cortex-A78 + 4× Cortex-A55 |
| Max clock | 2.4 GHz | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed |
| Architecture | ARMv8.2-A, 64-bit | ARMv8.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | ||
| GPU | Mali-G610 MC3 at 864 MHz | Mali-G615 MC2 |
| GPU clock | 864 MHz | No specific official figure from MediaTek |
| NPU | Not officially documented in detail | MediaTek APU 655 |
| AI performance | Not officially announced | No specific figure announced by the company |
| الذاكرة والاتصال | ||
| Supported RAM | LPDDR5 | LPDDR4X |
| Max RAM | 3200 MHz | No exact official figure |
| Supported storage | UFS 2.2 / UFS 3.1 | UFS 3.1 |
| Modem | Balong (integrated) | Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 6 (Wi-Fi 7 on some newer models) | Wi-Fi 6 |
| Bluetooth | 5.2 | 5.4 |
| نتائج الاختبارات | ||
| AnTuTu | ~666,377 | ~983,589 |
| Geekbench single-core | ~1019 | ~998 – 1003 |
| Geekbench multi-core | ~3007 | ~2869 – 2881 |
| مميزات إضافية | ||
| Key features | Large battery up to 6620 mAh, 40W fast charging, Ark Engine and HarmonyOS optimisations | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video |
| Phones using it | nova 12, nova Flip S, Enjoy 70X/90/90 Plus/90 Pro Max/90m Plus, nova 13/13 Pro/14, MatePad 11.5 (2024) | Realme 16 Pro 5G (January 2026) |
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