Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
There are 8 key differences between Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks.
ميديا تيك (MediaTek)
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
7.5
Key differences
| Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | HiSilicon (a Huawei subsidiary) | MediaTek |
| Fabrication | 7 nm (SMIC N+2) | 4 nm (TSMC N4P) |
| Announced | Leaked December 2023 — officially launched October 2024 | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| Core configuration | 1× Cortex-A77 at 2.4GHz + 3× Cortex-A77 at 2.19GHz + 4× Cortex-A55 at 1.84GHz | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 2.4 GHz | 3.4 GHz |
| Architecture | ARMv8.2-A, 64-bit | ARMv9.2-A, 64-bit |
| GPU | Mali-G610 MC3 at 864 MHz | Mali-G720 MC8 |
| GPU clock | 864 MHz | ~1300–1500 MHz (slight variation between sources) |
Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks
The Kirin 8000 is a chip suited to everyday use — browsing, social media, camera — inside Huawei's mid-priced phones. It does not target gamers or anyone after flagship-level performance, largely because of the ongoing manufacturing restrictions on Huawei.
- +Large battery with good endurance
- +Smooth day-to-day performance thanks to HarmonyOS and Ark Engine optimisations
- +Modern 5G and Wi-Fi (6 or 7 depending on the model)
- −Still stuck on a 7nm process because of US sanctions
- −Relatively dated core architecture (Cortex-A77/A55) next to rivals such as the Dimensity 7000 series or newer Snapdragon 7 chips
- −Not enough official transparency on the NPU and its AI capabilities
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.
- +An all-big-core design that delivers very strong processing performance
- +Top-tier LPDDR5X memory and UFS 4.1 storage
- +Advanced generative AI support via the NPU 880
- −Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
- −Less consistent performance during long gaming sessions
- −Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
Full specifications
| Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| التصنيع | ||
| Manufacturer | HiSilicon (a Huawei subsidiary) | MediaTek |
| Fabrication | 7 nm (SMIC N+2) | 4 nm (TSMC N4P) |
| Announced | Leaked December 2023 — officially launched October 2024 | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| Availability | Available | Available |
| المعالج المركزي | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 1× Cortex-A77 at 2.4GHz + 3× Cortex-A77 at 2.19GHz + 4× Cortex-A55 at 1.84GHz | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 2.4 GHz | 3.4 GHz |
| Architecture | ARMv8.2-A, 64-bit | ARMv9.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | ||
| GPU | Mali-G610 MC3 at 864 MHz | Mali-G720 MC8 |
| GPU clock | 864 MHz | ~1300–1500 MHz (slight variation between sources) |
| NPU | Not officially documented in detail | MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation) |
| AI performance | Not officially announced | No specific figure announced by MediaTek |
| الذاكرة والاتصال | ||
| Supported RAM | LPDDR5 | LPDDR5X |
| Max RAM | 3200 MHz | Up to 9600 Mbps |
| Supported storage | UFS 2.2 / UFS 3.1 | UFS 4.1 |
| Modem | Balong (integrated) | Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 6 (Wi-Fi 7 on some newer models) | Wi-Fi 6E |
| Bluetooth | 5.2 | 5.4 |
| نتائج الاختبارات | ||
| AnTuTu | ~666,377 | ~2,136,906 |
| Geekbench single-core | ~1019 | ~1,708 – 1,725 |
| Geekbench multi-core | ~3007 | ~6,297 – 6,860 |
| مميزات إضافية | ||
| Key features | Large battery up to 6620 mAh, 40W fast charging, Ark Engine and HarmonyOS optimisations | Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving |
| Phones using it | nova 12, nova Flip S, Enjoy 70X/90/90 Plus/90 Pro Max/90m Plus, nova 13/13 Pro/14, MatePad 11.5 (2024) | Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5 |
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