Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks
There are 8 key differences between Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks and Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks.
Key differences
| Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | HiSilicon (a Huawei subsidiary) | Qualcomm |
| Fabrication | 7 nm (SMIC N+2) | 4 nm (Samsung) |
| Announced | Leaked December 2023 — officially launched October 2024 | 2 September 2024 (without an official press release) |
| Core configuration | 1× Cortex-A77 at 2.4GHz + 3× Cortex-A77 at 2.19GHz + 4× Cortex-A55 at 1.84GHz | 4× Cortex-A78 at 2.4 GHz + 4× Cortex-A55 at 1.8 GHz |
| GPU | Mali-G610 MC3 at 864 MHz | Adreno 710 |
| GPU clock | 864 MHz | No exact figure announced by Qualcomm |
| NPU | Not officially documented in detail | Qualcomm AI Engine (Hexagon NPU) — 20% better at tasks such as noise cancellation and activity tracking |
| AI performance | Not officially announced | Not officially announced by Qualcomm |
Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks
The Kirin 8000 is a chip suited to everyday use — browsing, social media, camera — inside Huawei's mid-priced phones. It does not target gamers or anyone after flagship-level performance, largely because of the ongoing manufacturing restrictions on Huawei.
- +Large battery with good endurance
- +Smooth day-to-day performance thanks to HarmonyOS and Ark Engine optimisations
- +Modern 5G and Wi-Fi (6 or 7 depending on the model)
- −Still stuck on a 7nm process because of US sanctions
- −Relatively dated core architecture (Cortex-A77/A55) next to rivals such as the Dimensity 7000 series or newer Snapdragon 7 chips
- −Not enough official transparency on the NPU and its AI capabilities
Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks
A dependable, practical mid-range chip for everyday use with modern 5G connectivity. Despite the name it is not a real performance leap over the previous generation, so pick a device with good memory and storage to get the most out of it.
- +Modern 5G with mmWave, plus Wi-Fi 6E
- +Good camera support up to 200MP and 4K HDR video
- +Smooth performance in everyday tasks and light to mid-weight games
- −Only a marginal step up from the previous Snapdragon 6 Gen 1
- −The Adreno 710 GPU is completely unchanged from the previous generation
- −Performance varies widely with the device design (up to a 200,000-point AnTuTu spread)
Full specifications
| Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| التصنيع | ||
| Manufacturer | HiSilicon (a Huawei subsidiary) | Qualcomm |
| Fabrication | 7 nm (SMIC N+2) | 4 nm (Samsung) |
| Announced | Leaked December 2023 — officially launched October 2024 | 2 September 2024 (without an official press release) |
| Availability | Available | Available |
| المعالج المركزي | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 1× Cortex-A77 at 2.4GHz + 3× Cortex-A77 at 2.19GHz + 4× Cortex-A55 at 1.84GHz | 4× Cortex-A78 at 2.4 GHz + 4× Cortex-A55 at 1.8 GHz |
| Max clock | 2.4 GHz | 2.4 GHz |
| Architecture | ARMv8.2-A, 64-bit | ARMv8.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | ||
| GPU | Mali-G610 MC3 at 864 MHz | Adreno 710 |
| GPU clock | 864 MHz | No exact figure announced by Qualcomm |
| NPU | Not officially documented in detail | Qualcomm AI Engine (Hexagon NPU) — 20% better at tasks such as noise cancellation and activity tracking |
| AI performance | Not officially announced | Not officially announced by Qualcomm |
| الذاكرة والاتصال | ||
| Supported RAM | LPDDR5 | LPDDR4X / LPDDR5 |
| Max RAM | 3200 MHz | 3200 MHz (up to 12 GB) |
| Supported storage | UFS 2.2 / UFS 3.1 | UFS 3.1 (some devices may use UFS 2.2) |
| Modem | Balong (integrated) | Integrated 5G (with mmWave), theoretical download up to 2.9 Gbps |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 6 (Wi-Fi 7 on some newer models) | Wi-Fi 6E |
| Bluetooth | 5.2 | 5.2 |
| نتائج الاختبارات | ||
| AnTuTu | ~666,377 | ~840,643–868,311 (with some devices as low as ~620,000 depending on the design) |
| Geekbench single-core | ~1019 | ~1,015 – 1,021 |
| Geekbench multi-core | ~3007 | ~2,910 – 2,920 |
| مميزات إضافية | ||
| Key features | Large battery up to 6620 mAh, 40W fast charging, Ark Engine and HarmonyOS optimisations | Camera support up to 200 MP, 4K HDR video at 30fps, selected Snapdragon Elite Gaming features (VRS, Game Color Plus, Game Quick Touch), Quick Charge 4+ support |
| Phones using it | nova 12, nova Flip S, Enjoy 70X/90/90 Plus/90 Pro Max/90m Plus, nova 13/13 Pro/14, MatePad 11.5 (2024) | Samsung Galaxy A36, Xiaomi Redmi Note 15 5G, Poco M8 5G, Sony Xperia 10 VII, Motorola Moto G75 |
Other comparisons
Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
Huawei Kirin 8000 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks