MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
There are 8 key differences between MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks.
ميديا تيك (MediaTek)
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
7.5
Key differences
| MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Fabrication | 4 nm (TSMC) | 4 nm (TSMC N4P) |
| Announced | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| Core configuration | 4× Cortex-A78 + 4× Cortex-A55 | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed | 3.4 GHz |
| Architecture | ARMv8.2-A, 64-bit | ARMv9.2-A, 64-bit |
| GPU | Mali-G615 MC2 | Mali-G720 MC8 |
| GPU clock | No specific official figure from MediaTek | ~1300–1500 MHz (slight variation between sources) |
| NPU | MediaTek APU 655 | MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation) |
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.
- +Excellent power efficiency thanks to the 4nm process
- +UFS 3.1 storage support instead of UFS 2.2
- +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
- −Still on LPDDR4X memory rather than LPDDR5X
- −Limited graphics performance in demanding games
- −The real-world gap to the standard Dimensity 7300 is unclear in everyday use
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.
- +An all-big-core design that delivers very strong processing performance
- +Top-tier LPDDR5X memory and UFS 4.1 storage
- +Advanced generative AI support via the NPU 880
- −Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
- −Less consistent performance during long gaming sessions
- −Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
Full specifications
| MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| التصنيع | ||
| Manufacturer | MediaTek | MediaTek |
| Fabrication | 4 nm (TSMC) | 4 nm (TSMC N4P) |
| Announced | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| Availability | Available | Available |
| المعالج المركزي | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 4× Cortex-A78 + 4× Cortex-A55 | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed | 3.4 GHz |
| Architecture | ARMv8.2-A, 64-bit | ARMv9.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | ||
| GPU | Mali-G615 MC2 | Mali-G720 MC8 |
| GPU clock | No specific official figure from MediaTek | ~1300–1500 MHz (slight variation between sources) |
| NPU | MediaTek APU 655 | MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation) |
| AI performance | No specific figure announced by the company | No specific figure announced by MediaTek |
| الذاكرة والاتصال | ||
| Supported RAM | LPDDR4X | LPDDR5X |
| Max RAM | No exact official figure | Up to 9600 Mbps |
| Supported storage | UFS 3.1 | UFS 4.1 |
| Modem | Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps | Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 6 | Wi-Fi 6E |
| Bluetooth | 5.4 | 5.4 |
| نتائج الاختبارات | ||
| AnTuTu | ~983,589 | ~2,136,906 |
| Geekbench single-core | ~998 – 1003 | ~1,708 – 1,725 |
| Geekbench multi-core | ~2869 – 2881 | ~6,297 – 6,860 |
| مميزات إضافية | ||
| Key features | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video | Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving |
| Phones using it | Realme 16 Pro 5G (January 2026) | Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5 |
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