Google Tensor G6 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
There are 8 key differences between Google Tensor G6 Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks.
Key differences
| Google Tensor G6 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | Google (manufactured by TSMC) | MediaTek (manufactured by TSMC) |
| Fabrication | 3nm (TSMC N3P) | 4nm |
| Announced | August 12, 2026 | May 27, 2026 |
| CPU cores | 7 cores | 8 cores (all Cortex-A725) |
| Core configuration | 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz | 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz |
| Max clock | 4.11 GHz | 3.4 GHz |
| Architecture | Arm C1 (Lumex), Armv9.3-A | All Big Core (Cortex-A725) |
| GPU | PowerVR C-Series CXTP-48-1536 | Arm Mali-G720 MC8 |
Google Tensor G6 Chipset Review — Specifications and Benchmarks
Google Tensor G6 powers the entire Pixel 11 lineup with new Arm C1 cores and a MediaTek modem, prioritizing AI over benchmark numbers.
- +Move to Arm's latest C1 cores and Armv9.3-A architecture.
- +Fundamentally upgraded TPU for better AI performance.
- +New MediaTek modem improves heat and battery drain.
- −PowerVR GPU is much weaker than Qualcomm and MediaTek rivals.
- −Unusual 7-core design instead of 8 affected multi-core results.
- −Large gap in synthetic benchmarks compared to flagship Qualcomm chips.
MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
Dimensity 8550 is primarily an AI update rather than a performance upgrade, keeping the same CPU and GPU as the Dimensity 8500 while adding a new NPU 880 with Gemini Nano V3 support.
- +New NPU 880 unit with Gemini Nano V3 support.
- +All-Big-Core design delivers strong sustained performance.
- +Faster LPDDR5X memory and UFS 4.0 storage.
- −Not a genuine raw performance upgrade over the previous Dimensity 8500.
- −May confuse consumers due to near-identical core specifications.
Full specifications
| Google Tensor G6 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | Google (manufactured by TSMC) | MediaTek (manufactured by TSMC) |
| Fabrication | 3nm (TSMC N3P) | 4nm |
| Announced | August 12, 2026 | May 27, 2026 |
| Availability | Available | Available |
| CPU | ||
| CPU cores | 7 cores | 8 cores (all Cortex-A725) |
| Core configuration | 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz | 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz |
| Max clock | 4.11 GHz | 3.4 GHz |
| Architecture | Arm C1 (Lumex), Armv9.3-A | All Big Core (Cortex-A725) |
| Graphics & AI | ||
| GPU | PowerVR C-Series CXTP-48-1536 | Arm Mali-G720 MC8 |
| GPU clock | — | Approximately 1500MHz |
| NPU | Upgraded TPU (+50% performance) | NPU 880 with LLM Booster |
| AI performance | On-device Gemini Nano support | Google Gemini Nano V3 support |
| Memory & connectivity | ||
| Supported RAM | — | LPDDR5X |
| Max RAM | — | Up to 9600Mbps |
| Supported storage | — | UFS 4.0 |
| Modem | MediaTek M90 | — |
| 5G | Yes | Yes (5G-Advanced) |
| Wi-Fi | Wi-Fi 7 | Wi-Fi 6E |
| Bluetooth | 6.0 | 5.4 |
| Benchmarks | ||
| AnTuTu | Approximately 1.8-2 million | Approximately 2-2.4 million |
| Geekbench single-core | Approximately 6,115 | Approximately 1,761-2,027 |
| Geekbench multi-core | Approximately 2,436 | Approximately 7,148-7,208 |
| Extra features | ||
| Key features | First Tensor chip with a MediaTek modem instead of Samsung | — |
| Phones using it | Google Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL, Pixel 11 Pro Fold | Oppo Reno16 Pro |
Other comparisons
Google Tensor G6 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
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