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Google Tensor G6 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks

There are 8 key differences between Google Tensor G6 Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks.

Key differences

Google Tensor G6 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks — Key differences
Google Tensor G6 Chipset Review — Specifications and Benchmarks MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
Manufacturer Google (manufactured by TSMC) MediaTek (manufactured by TSMC)
Fabrication 3nm (TSMC N3P) 4nm
Announced August 12, 2026 May 27, 2026
CPU cores 7 cores 8 cores (all Cortex-A725)
Core configuration 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz
Max clock 4.11 GHz 3.4 GHz
Architecture Arm C1 (Lumex), Armv9.3-A All Big Core (Cortex-A725)
GPU PowerVR C-Series CXTP-48-1536 Arm Mali-G720 MC8

Google Tensor G6 Chipset Review — Specifications and Benchmarks

Google Tensor G6 powers the entire Pixel 11 lineup with new Arm C1 cores and a MediaTek modem, prioritizing AI over benchmark numbers.

  • +Move to Arm's latest C1 cores and Armv9.3-A architecture.
  • +Fundamentally upgraded TPU for better AI performance.
  • +New MediaTek modem improves heat and battery drain.
  • PowerVR GPU is much weaker than Qualcomm and MediaTek rivals.
  • Unusual 7-core design instead of 8 affected multi-core results.
  • Large gap in synthetic benchmarks compared to flagship Qualcomm chips.
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MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks

Dimensity 8550 is primarily an AI update rather than a performance upgrade, keeping the same CPU and GPU as the Dimensity 8500 while adding a new NPU 880 with Gemini Nano V3 support.

  • +New NPU 880 unit with Gemini Nano V3 support.
  • +All-Big-Core design delivers strong sustained performance.
  • +Faster LPDDR5X memory and UFS 4.0 storage.
  • Not a genuine raw performance upgrade over the previous Dimensity 8500.
  • May confuse consumers due to near-identical core specifications.
Read the full review →

Full specifications

Google Tensor G6 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks — Full specifications
Google Tensor G6 Chipset Review — Specifications and Benchmarks MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
Manufacturing
Manufacturer Google (manufactured by TSMC) MediaTek (manufactured by TSMC)
Fabrication 3nm (TSMC N3P) 4nm
Announced August 12, 2026 May 27, 2026
Availability Available Available
CPU
CPU cores 7 cores 8 cores (all Cortex-A725)
Core configuration 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz
Max clock 4.11 GHz 3.4 GHz
Architecture Arm C1 (Lumex), Armv9.3-A All Big Core (Cortex-A725)
Graphics & AI
GPU PowerVR C-Series CXTP-48-1536 Arm Mali-G720 MC8
GPU clock Approximately 1500MHz
NPU Upgraded TPU (+50% performance) NPU 880 with LLM Booster
AI performance On-device Gemini Nano support Google Gemini Nano V3 support
Memory & connectivity
Supported RAM LPDDR5X
Max RAM Up to 9600Mbps
Supported storage UFS 4.0
Modem MediaTek M90
5G Yes Yes (5G-Advanced)
Wi-Fi Wi-Fi 7 Wi-Fi 6E
Bluetooth 6.0 5.4
Benchmarks
AnTuTu Approximately 1.8-2 million Approximately 2-2.4 million
Geekbench single-core Approximately 6,115 Approximately 1,761-2,027
Geekbench multi-core Approximately 2,436 Approximately 7,148-7,208
Extra features
Key features First Tensor chip with a MediaTek modem instead of Samsung
Phones using it Google Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL, Pixel 11 Pro Fold Oppo Reno16 Pro

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