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MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks vs MediaTek Helio G81 Ultra Chipset Review — Specifications and Benchmarks

There are 8 key differences between MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks and MediaTek Helio G81 Ultra Chipset Review — Specifications and Benchmarks.

Key differences

MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks vs MediaTek Helio G81 Ultra Chipset Review — Specifications and Benchmarks — Key differences
MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks MediaTek Helio G81 Ultra Chipset Review — Specifications and Benchmarks
Fabrication 6 nm (TSMC) 12nm FinFET
Core configuration 2× Cortex-A76 at 2.5 GHz + 6× Cortex-A55 at 2.0 GHz 2x Cortex-A75 2.0GHz + 6x Cortex-A55 2.0GHz
Max clock 2.5 GHz 2.0 GHz
GPU Mali-G57 MC2 Mali-G52 MC2
GPU clock No specific official figure from MediaTek Up to 950MHz
Supported RAM LPDDR4X LPDDR4x
Supported storage UFS 2.2 eMMC 5.1
5G Yes No

MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks

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MediaTek Helio G81 Ultra Chipset Review — Specifications and Benchmarks

The Helio G81 Ultra targets the cheapest price segment, supporting 120Hz displays for the first time in the G8x series.

  • +Supports up to 120Hz displays for the first time in the G8x series.
  • +HyperEngine technology for dynamic resource management.
  • +Very low cost suited for the cheapest phone tier.
  • No 5G network support.
  • Relatively older 12nm process.
  • eMMC 5.1 storage is slower than modern UFS.
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Full specifications

MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks vs MediaTek Helio G81 Ultra Chipset Review — Specifications and Benchmarks — Full specifications
MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks MediaTek Helio G81 Ultra Chipset Review — Specifications and Benchmarks
Manufacturing
Manufacturer MediaTek MediaTek
Fabrication 6 nm (TSMC) 12nm FinFET
Announced February 2025 (as the base Dimensity 6400) — appeared as the "Turbo" exclusively with the Realme 16 in January 2026
Availability Available Available
CPU
CPU cores 8 cores 8 cores
Core configuration 2× Cortex-A76 at 2.5 GHz + 6× Cortex-A55 at 2.0 GHz 2x Cortex-A75 2.0GHz + 6x Cortex-A55 2.0GHz
Max clock 2.5 GHz 2.0 GHz
Architecture ARMv8.2-A, 64-bit (not ARMv9)
Graphics & AI
GPU Mali-G57 MC2 Mali-G52 MC2
GPU clock No specific official figure from MediaTek Up to 950MHz
NPU Not officially documented as a separate unit (a budget chip with no AI marketing focus)
AI performance Not officially announced
Memory & connectivity
Supported RAM LPDDR4X LPDDR4x
Max RAM 2133 MHz
Supported storage UFS 2.2 eMMC 5.1
Modem Integrated Sub-6 5G modem, with dual 5G SIM support
5G Yes No
Wi-Fi Wi-Fi 5 (officially from the chip) — some devices such as the Realme 16 add Wi-Fi 6 via an external module Wi-Fi 5
Bluetooth 5.2 (officially from the chip) — the Realme 16 uses 5.3/5.4 at device level 5.0
Benchmarks
AnTuTu ~544,000–604,000 (varies with the device and accompanying RAM)
Geekbench single-core ~764 – 803
Geekbench multi-core ~1978 – 2159
Extra features
Key features Relatively good thermal stability in long tests (99.5% consistency), camera support up to 108 MP, displays up to 120Hz at FHD+ Supports up to 120Hz displays
Phones using it Realme 16 5G (as the "Turbo") — the same base chip is also used in devices such as the Motorola Moto G87, Realme 15T and Tecno Pova Slim 5G under the standard Dimensity 6400 name HONOR X7e

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