Qayimli

MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks vs Unisoc T7250 Chipset Review — Specifications and Benchmarks

There are 8 key differences between MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks and Unisoc T7250 Chipset Review — Specifications and Benchmarks.

Key differences

MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks vs Unisoc T7250 Chipset Review — Specifications and Benchmarks — Key differences
MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks Unisoc T7250 Chipset Review — Specifications and Benchmarks
Manufacturer MediaTek Unisoc
Fabrication 6 nm (TSMC) 12nm
Announced February 2025 (as the base Dimensity 6400) — appeared as the "Turbo" exclusively with the Realme 16 in January 2026 Late 2024 (rebrand of T615)
Core configuration 2× Cortex-A76 at 2.5 GHz + 6× Cortex-A55 at 2.0 GHz 2x Cortex-A75 + 6x Cortex-A55
Max clock 2.5 GHz Up to 2.0 GHz
GPU Mali-G57 MC2 Mali-G57 (single-core)
GPU clock No specific official figure from MediaTek Up to 850MHz
Supported storage UFS 2.2 eMMC or UFS

MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks

Read the full review →

Unisoc T7250 Chipset Review — Specifications and Benchmarks

Unisoc T7250 is a budget choice for entry-level 4G-only phones, offering moderate performance with good power efficiency.

  • +Very low power consumption supports longer battery life.
  • +Suitable performance for calls, browsing, and basic daily use.
  • +Very low cost suited for very budget phones.
  • No 5G network support.
  • No dedicated AI processing unit.
  • Graphics performance weaker than rivals like the Helio G85.
Read the full review →

Full specifications

MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks vs Unisoc T7250 Chipset Review — Specifications and Benchmarks — Full specifications
MediaTek Dimensity 6400 Turbo Chipset Review — Specifications and Benchmarks Unisoc T7250 Chipset Review — Specifications and Benchmarks
Manufacturing
Manufacturer MediaTek Unisoc
Fabrication 6 nm (TSMC) 12nm
Announced February 2025 (as the base Dimensity 6400) — appeared as the "Turbo" exclusively with the Realme 16 in January 2026 Late 2024 (rebrand of T615)
Availability Available Available
CPU
CPU cores 8 cores 8 cores
Core configuration 2× Cortex-A76 at 2.5 GHz + 6× Cortex-A55 at 2.0 GHz 2x Cortex-A75 + 6x Cortex-A55
Max clock 2.5 GHz Up to 2.0 GHz
Architecture ARMv8.2-A, 64-bit (not ARMv9)
Graphics & AI
GPU Mali-G57 MC2 Mali-G57 (single-core)
GPU clock No specific official figure from MediaTek Up to 850MHz
NPU Not officially documented as a separate unit (a budget chip with no AI marketing focus)
AI performance Not officially announced
Memory & connectivity
Supported RAM LPDDR4X LPDDR4X
Max RAM 2133 MHz
Supported storage UFS 2.2 eMMC or UFS
Modem Integrated Sub-6 5G modem, with dual 5G SIM support
5G Yes No
Wi-Fi Wi-Fi 5 (officially from the chip) — some devices such as the Realme 16 add Wi-Fi 6 via an external module
Bluetooth 5.2 (officially from the chip) — the Realme 16 uses 5.3/5.4 at device level
Benchmarks
AnTuTu ~544,000–604,000 (varies with the device and accompanying RAM) Approximately 210,000-263,000
Geekbench single-core ~764 – 803
Geekbench multi-core ~1978 – 2159
Extra features
Key features Relatively good thermal stability in long tests (99.5% consistency), camera support up to 108 MP, displays up to 120Hz at FHD+
Phones using it Realme 16 5G (as the "Turbo") — the same base chip is also used in devices such as the Motorola Moto G87, Realme 15T and Tecno Pova Slim 5G under the standard Dimensity 6400 name Xiaomi Redmi A7

Other comparisons