MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs Unisoc T7300 Chipset Review — Specifications and Benchmarks
There are 8 key differences between MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks and Unisoc T7300 Chipset Review — Specifications and Benchmarks.
Key differences
| MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | Unisoc T7300 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | MediaTek | Unisoc |
| Announced | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) | 2025 |
| 5G | Yes | No |
| Wi-Fi | Wi-Fi 6 | Wi-Fi 5 |
| AnTuTu | ~983,589 | Approximately 500,000+ |
| Geekbench single-core | ~998 – 1003 | 924 |
| Geekbench multi-core | ~2869 – 2881 | 2248 |
| Key features | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video | Described as the fastest 4G-only chipset in the world |
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.
- +Excellent power efficiency thanks to the 4nm process
- +UFS 3.1 storage support instead of UFS 2.2
- +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
- −Still on LPDDR4X memory rather than LPDDR5X
- −Limited graphics performance in demanding games
- −The real-world gap to the standard Dimensity 7300 is unclear in everyday use
Unisoc T7300 Chipset Review — Specifications and Benchmarks
Unisoc T7300 is described as the fastest 4G-only chipset in the world, with performance rivaling the Snapdragon 4 Gen 2 and Dimensity 6400.
- +Fastest 4G-only chipset in the world per independent testing.
- +Camera support up to 108MP and 2K video.
- +Supports 120Hz display refresh rate.
- −No 5G network support.
- −Limited to Wi-Fi 5 without Wi-Fi 6 support.
Full specifications
| MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | Unisoc T7300 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | MediaTek | Unisoc |
| Fabrication | 4 nm (TSMC) | — |
| Announced | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) | 2025 |
| Availability | Available | Available |
| CPU | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 4× Cortex-A78 + 4× Cortex-A55 | — |
| Max clock | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed | — |
| Architecture | ARMv8.2-A, 64-bit | — |
| Graphics & AI | ||
| GPU | Mali-G615 MC2 | — |
| GPU clock | No specific official figure from MediaTek | — |
| NPU | MediaTek APU 655 | — |
| AI performance | No specific figure announced by the company | — |
| Memory & connectivity | ||
| Supported RAM | LPDDR4X | — |
| Max RAM | No exact official figure | — |
| Supported storage | UFS 3.1 | — |
| Modem | Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps | — |
| 5G | Yes | No |
| Wi-Fi | Wi-Fi 6 | Wi-Fi 5 |
| Bluetooth | 5.4 | — |
| Benchmarks | ||
| AnTuTu | ~983,589 | Approximately 500,000+ |
| Geekbench single-core | ~998 – 1003 | 924 |
| Geekbench multi-core | ~2869 – 2881 | 2248 |
| Extra features | ||
| Key features | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video | Described as the fastest 4G-only chipset in the world |
| Phones using it | Realme 16 Pro 5G (January 2026) | vivo Y500 (global variant) |
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