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MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs Samsung Exynos 1330 Chipset Review — Specifications and Benchmarks

There are 8 key differences between MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks and Samsung Exynos 1330 Chipset Review — Specifications and Benchmarks.

Key differences

MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs Samsung Exynos 1330 Chipset Review — Specifications and Benchmarks — Key differences
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks Samsung Exynos 1330 Chipset Review — Specifications and Benchmarks
Manufacturer MediaTek Samsung
Fabrication 4 nm (TSMC) 5nm
Announced January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) Early 2023
Core configuration 4× Cortex-A78 + 4× Cortex-A55 2x Cortex-A78 2.4GHz + 6x Cortex-A55 2.0GHz
Max clock 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed 2.4 GHz
GPU Mali-G615 MC2 Mali-G68 MP2
Supported RAM LPDDR4X LPDDR4x/LPDDR5
Supported storage UFS 3.1 UFS 2.2/3.1

MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks

A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.

  • +Excellent power efficiency thanks to the 4nm process
  • +UFS 3.1 storage support instead of UFS 2.2
  • +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
  • Still on LPDDR4X memory rather than LPDDR5X
  • Limited graphics performance in demanding games
  • The real-world gap to the standard Dimensity 7300 is unclear in everyday use
Read the full review →

Samsung Exynos 1330 Chipset Review — Specifications and Benchmarks

The Exynos 1330 outperforms its rival Helio G99 by roughly 15%, thanks to a more advanced 5nm process and stronger Cortex-A78 cores.

  • +Better performance than rivals like the Helio G99.
  • +More advanced 5nm process.
  • +Supports 5G networks with good speeds.
  • Still limited to Wi-Fi 5 without Wi-Fi 6 support.
  • Slightly higher power draw than rival MediaTek Helio G99.
Read the full review →

Full specifications

MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs Samsung Exynos 1330 Chipset Review — Specifications and Benchmarks — Full specifications
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks Samsung Exynos 1330 Chipset Review — Specifications and Benchmarks
Manufacturing
Manufacturer MediaTek Samsung
Fabrication 4 nm (TSMC) 5nm
Announced January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) Early 2023
Availability Available Available
CPU
CPU cores 8 cores 8 cores
Core configuration 4× Cortex-A78 + 4× Cortex-A55 2x Cortex-A78 2.4GHz + 6x Cortex-A55 2.0GHz
Max clock 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed 2.4 GHz
Architecture ARMv8.2-A, 64-bit
Graphics & AI
GPU Mali-G615 MC2 Mali-G68 MP2
GPU clock No specific official figure from MediaTek
NPU MediaTek APU 655
AI performance No specific figure announced by the company
Memory & connectivity
Supported RAM LPDDR4X LPDDR4x/LPDDR5
Max RAM No exact official figure
Supported storage UFS 3.1 UFS 2.2/3.1
Modem Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps
5G Yes Yes (up to 2.55Gbps)
Wi-Fi Wi-Fi 6 Wi-Fi 5
Bluetooth 5.4 5.2
Benchmarks
AnTuTu ~983,589 Approximately 412,000-608,000
Geekbench single-core ~998 – 1003
Geekbench multi-core ~2869 – 2881
Extra features
Key features Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video
Phones using it Realme 16 Pro 5G (January 2026) Samsung Galaxy A17 5G

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