MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs MediaTek Helio G81 Ultimate Chipset Review — Specifications and Benchmarks
There are 8 key differences between MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks and MediaTek Helio G81 Ultimate Chipset Review — Specifications and Benchmarks.
Key differences
| MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | MediaTek Helio G81 Ultimate Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Fabrication | 4 nm (TSMC) | 12 nm (TSMC) |
| Announced | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) | August 2024 (the "Ultimate" name is a marketing label some manufacturers apply to the same base Helio G81 chip) |
| Core configuration | 4× Cortex-A78 + 4× Cortex-A55 | 2× Cortex-A75 at 2.0 GHz + 6× Cortex-A55 at 1.8 GHz |
| Max clock | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed | 2.0 GHz |
| GPU | Mali-G615 MC2 | Mali-G52 MC2 |
| GPU clock | No specific official figure from MediaTek | 820–950 MHz (slight variation between sources) |
| NPU | MediaTek APU 655 | No powerful dedicated NPU; only light CPU-based AI enhancements for object recognition and photo classification |
| AI performance | No specific figure announced by the company | Not announced (a chip with no AI focus) |
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks
A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.
- +Excellent power efficiency thanks to the 4nm process
- +UFS 3.1 storage support instead of UFS 2.2
- +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
- −Still on LPDDR4X memory rather than LPDDR5X
- −Limited graphics performance in demanding games
- −The real-world gap to the standard Dimensity 7300 is unclear in everyday use
MediaTek Helio G81 Ultimate Chipset Review — Specifications and Benchmarks
An extremely low-cost chip suited only to very cheap phones and basic tasks. Clear limits in connectivity and storage make it a poor fit if you want a phone that lasts for years or genuinely modern performance.
- +Very low power draw, which helps battery life
- +Support for displays up to 120Hz
- +Very low prices on the phones that carry it
- −No 5G support at all
- −Dated, slow eMMC 5.1 storage instead of UFS
- −Relatively dated core architecture (Cortex-A75/A55)
Full specifications
| MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks | MediaTek Helio G81 Ultimate Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| التصنيع | ||
| Manufacturer | MediaTek | MediaTek |
| Fabrication | 4 nm (TSMC) | 12 nm (TSMC) |
| Announced | January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) | August 2024 (the "Ultimate" name is a marketing label some manufacturers apply to the same base Helio G81 chip) |
| Availability | Available | Available |
| المعالج المركزي | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 4× Cortex-A78 + 4× Cortex-A55 | 2× Cortex-A75 at 2.0 GHz + 6× Cortex-A55 at 1.8 GHz |
| Max clock | 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed | 2.0 GHz |
| Architecture | ARMv8.2-A, 64-bit | ARMv8.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | ||
| GPU | Mali-G615 MC2 | Mali-G52 MC2 |
| GPU clock | No specific official figure from MediaTek | 820–950 MHz (slight variation between sources) |
| NPU | MediaTek APU 655 | No powerful dedicated NPU; only light CPU-based AI enhancements for object recognition and photo classification |
| AI performance | No specific figure announced by the company | Not announced (a chip with no AI focus) |
| الذاكرة والاتصال | ||
| Supported RAM | LPDDR4X | LPDDR4X |
| Max RAM | No exact official figure | 1800 MHz |
| Supported storage | UFS 3.1 | eMMC 5.1 (not UFS) |
| Modem | Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps | Integrated 4G LTE only (Cat-7 download / Cat-13 upload) |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 6 | Wi-Fi 5 (802.11ac) |
| Bluetooth | 5.4 | 5.0 |
| نتائج الاختبارات | ||
| AnTuTu | ~983,589 | ~254,779 |
| Geekbench single-core | ~998 – 1003 | ~417 |
| Geekbench multi-core | ~2869 – 2881 | ~1,322 |
| مميزات إضافية | ||
| Key features | Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video | Display support up to 120Hz, MediaTek HyperEngine resource management, low power draw (a TDP of just 5W) |
| Phones using it | Realme 16 Pro 5G (January 2026) | Xiaomi Redmi 14C, Redmi 15C, Poco C75, Poco C85, Honor X6c, Realme C75x, Motorola Moto G06 Power, Blackview Oscal Pilot 1, DOOGEE Rugged Fire 5 Ultra, Infinix Smart 20 |
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