MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks vs Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks
There are 8 key differences between MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks and Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks.
Key differences
| MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks | Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | MediaTek (manufactured by TSMC) | Qualcomm (Samsung-exclusive) |
| Fabrication | 4nm | 3nm |
| Announced | May 27, 2026 | December 2025 |
| Availability | Available | Exclusive to one phone model |
| CPU cores | 8 cores (all Cortex-A725) | 8 cores |
| Architecture | All Big Core (Cortex-A725) | Oryon (first generation) |
| GPU | Arm Mali-G720 MC8 | Adreno (customized for the original Elite tier) |
| 5G | Yes (5G-Advanced) | Yes |
MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
Dimensity 8550 is primarily an AI update rather than a performance upgrade, keeping the same CPU and GPU as the Dimensity 8500 while adding a new NPU 880 with Gemini Nano V3 support.
- +New NPU 880 unit with Gemini Nano V3 support.
- +All-Big-Core design delivers strong sustained performance.
- +Faster LPDDR5X memory and UFS 4.0 storage.
- −Not a genuine raw performance upgrade over the previous Dimensity 8500.
- −May confuse consumers due to near-identical core specifications.
Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks
A special variant of the Snapdragon 8 Elite tuned for the power needs of the Samsung Galaxy Z TriFold, Samsung's first tri-folding phone.
- +Custom power tuning accounting for the tri-fold form factor.
- +Supports running two displays simultaneously efficiently.
- +Joint development with Samsung ensures precise device fit.
- −Based on the previous Snapdragon 8 Elite generation, not the newer Gen 5.
- −Exclusive to a single phone model as of this review.
Full specifications
| MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks | Snapdragon 8 Elite Customized for Galaxy Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | MediaTek (manufactured by TSMC) | Qualcomm (Samsung-exclusive) |
| Fabrication | 4nm | 3nm |
| Announced | May 27, 2026 | December 2025 |
| Availability | Available | Exclusive to one phone model |
| CPU | ||
| CPU cores | 8 cores (all Cortex-A725) | 8 cores |
| Core configuration | 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz | — |
| Max clock | 3.4 GHz | — |
| Architecture | All Big Core (Cortex-A725) | Oryon (first generation) |
| Graphics & AI | ||
| GPU | Arm Mali-G720 MC8 | Adreno (customized for the original Elite tier) |
| GPU clock | Approximately 1500MHz | — |
| NPU | NPU 880 with LLM Booster | — |
| AI performance | Google Gemini Nano V3 support | — |
| Memory & connectivity | ||
| Supported RAM | LPDDR5X | — |
| Max RAM | Up to 9600Mbps | — |
| Supported storage | UFS 4.0 | — |
| 5G | Yes (5G-Advanced) | Yes |
| Wi-Fi | Wi-Fi 6E | — |
| Bluetooth | 5.4 | — |
| Benchmarks | ||
| AnTuTu | Approximately 2-2.4 million | — |
| Geekbench single-core | Approximately 1,761-2,027 | — |
| Geekbench multi-core | Approximately 7,148-7,208 | — |
| Extra features | ||
| Key features | — | Custom-tuned for running two displays in a tri-folding phone |
| Phones using it | Oppo Reno16 Pro | Samsung Galaxy Z TriFold |
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