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MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks

There are 8 key differences between MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks and Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks.

Key differences

MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks — Key differences
MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks
Manufacturer MediaTek (manufactured by TSMC) Qualcomm
Announced May 27, 2026 February 13, 2025
CPU cores 8 cores (all Cortex-A725) 8 cores
Core configuration 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz 1x Kryo Prime 2.3GHz + 3x Kryo Gold 2.2GHz + 4x Kryo Silver 1.8GHz
Max clock 3.4 GHz 2.3 GHz
GPU Arm Mali-G720 MC8 Adreno 810
Supported RAM LPDDR5X LPDDR5/LPDDR4X
Supported storage UFS 4.0 UFS 3.1

MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks

Dimensity 8550 is primarily an AI update rather than a performance upgrade, keeping the same CPU and GPU as the Dimensity 8500 while adding a new NPU 880 with Gemini Nano V3 support.

  • +New NPU 880 unit with Gemini Nano V3 support.
  • +All-Big-Core design delivers strong sustained performance.
  • +Faster LPDDR5X memory and UFS 4.0 storage.
  • Not a genuine raw performance upgrade over the previous Dimensity 8500.
  • May confuse consumers due to near-identical core specifications.
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Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks

The Snapdragon 6 Gen 4 delivers a genuine performance leap for the "6-series," with AnTuTu scores up to 894,500 points and Wi-Fi 6E support.

  • +Notable performance jump that closes the gap with the older 7-series tier.
  • +Excellent thermal stability reaching up to 85% in extended tests.
  • +Supports modern Wi-Fi 6/6E and Bluetooth 5.4.
  • Adreno 810 is the weakest tier within the Adreno 800 series.
  • Slightly behind rival Dimensity 7400 in thermal stability.
Read the full review →

Full specifications

MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks — Full specifications
MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks
Manufacturing
Manufacturer MediaTek (manufactured by TSMC) Qualcomm
Fabrication 4nm 4nm
Announced May 27, 2026 February 13, 2025
Availability Available Available
CPU
CPU cores 8 cores (all Cortex-A725) 8 cores
Core configuration 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz 1x Kryo Prime 2.3GHz + 3x Kryo Gold 2.2GHz + 4x Kryo Silver 1.8GHz
Max clock 3.4 GHz 2.3 GHz
Architecture All Big Core (Cortex-A725)
Graphics & AI
GPU Arm Mali-G720 MC8 Adreno 810
GPU clock Approximately 1500MHz
NPU NPU 880 with LLM Booster
AI performance Google Gemini Nano V3 support
Memory & connectivity
Supported RAM LPDDR5X LPDDR5/LPDDR4X
Max RAM Up to 9600Mbps
Supported storage UFS 4.0 UFS 3.1
5G Yes (5G-Advanced) Yes
Wi-Fi Wi-Fi 6E Wi-Fi 6/6E
Bluetooth 5.4 5.4
Benchmarks
AnTuTu Approximately 2-2.4 million Approximately 764,000-894,500
Geekbench single-core Approximately 1,761-2,027 Approximately 994
Geekbench multi-core Approximately 7,148-7,208 Approximately 3082
Extra features
Phones using it Oppo Reno16 Pro HONOR X9d

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