MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks
There are 8 key differences between MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks and Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks.
Key differences
| MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | MediaTek (manufactured by TSMC) | Qualcomm |
| Announced | May 27, 2026 | February 13, 2025 |
| CPU cores | 8 cores (all Cortex-A725) | 8 cores |
| Core configuration | 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz | 1x Kryo Prime 2.3GHz + 3x Kryo Gold 2.2GHz + 4x Kryo Silver 1.8GHz |
| Max clock | 3.4 GHz | 2.3 GHz |
| GPU | Arm Mali-G720 MC8 | Adreno 810 |
| Supported RAM | LPDDR5X | LPDDR5/LPDDR4X |
| Supported storage | UFS 4.0 | UFS 3.1 |
MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
Dimensity 8550 is primarily an AI update rather than a performance upgrade, keeping the same CPU and GPU as the Dimensity 8500 while adding a new NPU 880 with Gemini Nano V3 support.
- +New NPU 880 unit with Gemini Nano V3 support.
- +All-Big-Core design delivers strong sustained performance.
- +Faster LPDDR5X memory and UFS 4.0 storage.
- −Not a genuine raw performance upgrade over the previous Dimensity 8500.
- −May confuse consumers due to near-identical core specifications.
Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks
The Snapdragon 6 Gen 4 delivers a genuine performance leap for the "6-series," with AnTuTu scores up to 894,500 points and Wi-Fi 6E support.
- +Notable performance jump that closes the gap with the older 7-series tier.
- +Excellent thermal stability reaching up to 85% in extended tests.
- +Supports modern Wi-Fi 6/6E and Bluetooth 5.4.
- −Adreno 810 is the weakest tier within the Adreno 800 series.
- −Slightly behind rival Dimensity 7400 in thermal stability.
Full specifications
| MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | MediaTek (manufactured by TSMC) | Qualcomm |
| Fabrication | 4nm | 4nm |
| Announced | May 27, 2026 | February 13, 2025 |
| Availability | Available | Available |
| CPU | ||
| CPU cores | 8 cores (all Cortex-A725) | 8 cores |
| Core configuration | 1x 3.4GHz + 3x 3.2GHz + 4x 2.2GHz | 1x Kryo Prime 2.3GHz + 3x Kryo Gold 2.2GHz + 4x Kryo Silver 1.8GHz |
| Max clock | 3.4 GHz | 2.3 GHz |
| Architecture | All Big Core (Cortex-A725) | — |
| Graphics & AI | ||
| GPU | Arm Mali-G720 MC8 | Adreno 810 |
| GPU clock | Approximately 1500MHz | — |
| NPU | NPU 880 with LLM Booster | — |
| AI performance | Google Gemini Nano V3 support | — |
| Memory & connectivity | ||
| Supported RAM | LPDDR5X | LPDDR5/LPDDR4X |
| Max RAM | Up to 9600Mbps | — |
| Supported storage | UFS 4.0 | UFS 3.1 |
| 5G | Yes (5G-Advanced) | Yes |
| Wi-Fi | Wi-Fi 6E | Wi-Fi 6/6E |
| Bluetooth | 5.4 | 5.4 |
| Benchmarks | ||
| AnTuTu | Approximately 2-2.4 million | Approximately 764,000-894,500 |
| Geekbench single-core | Approximately 1,761-2,027 | Approximately 994 |
| Geekbench multi-core | Approximately 7,148-7,208 | Approximately 3082 |
| Extra features | ||
| Phones using it | Oppo Reno16 Pro | HONOR X9d |
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