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MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 8 Elite Gen 5 Chipset Review — Specifications and Benchmarks

There are 8 key differences between MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks and Qualcomm Snapdragon 8 Elite Gen 5 Chipset Review — Specifications and Benchmarks.

Key differences

MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 8 Elite Gen 5 Chipset Review — Specifications and Benchmarks — Key differences
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks Qualcomm Snapdragon 8 Elite Gen 5 Chipset Review — Specifications and Benchmarks
Manufacturer MediaTek Qualcomm
Fabrication 4 nm (TSMC) 3 nm (TSMC N3P)
Announced January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) 25 September 2025
Core configuration 4× Cortex-A78 + 4× Cortex-A55 2× Oryon Gen 3 Prime at 4.6 GHz + 6× Oryon Gen 3 Performance at 3.62 GHz — no separate efficiency cores
Max clock 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed 4.6 GHz
Architecture ARMv8.2-A, 64-bit ARMv9, 64-bit
GPU Mali-G615 MC2 Adreno 840
GPU clock No specific official figure from MediaTek No exact figure announced by Qualcomm

MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks

A dependable, balanced chip with genuine improvements to storage and connectivity over its predecessor, though not a big performance leap. It suits smooth everyday use rather than flagship-level gaming.

  • +Excellent power efficiency thanks to the 4nm process
  • +UFS 3.1 storage support instead of UFS 2.2
  • +Modern connectivity with Wi-Fi 6 and Bluetooth 5.4
  • Still on LPDDR4X memory rather than LPDDR5X
  • Limited graphics performance in demanding games
  • The real-world gap to the standard Dimensity 7300 is unclear in everyday use
Read the full review →

Qualcomm Snapdragon 8 Elite Gen 5 Chipset Review — Specifications and Benchmarks

An exceptional flagship chip that puts Qualcomm, for the first time, in genuine head-to-head competition with Apple's best, thanks to a radical step forward in CPU, graphics and imaging. Take care not to confuse it with the weaker Snapdragon 8 Gen 5 when buying.

  • +CPU performance that takes on the Apple A19 Pro directly and beats it in multitasking
  • +An upgraded GPU with desktop-class features (ray tracing, Unreal Engine 5)
  • +The first phone chip to support the professional APV video codec
  • Inconsistent thermal behaviour during very long gaming sessions
  • Easily confused with the weaker and completely different "Snapdragon 8 Gen 5"
  • The exact TOPS figure for the AI engine is not fully disclosed
Read the full review →

Full specifications

MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 8 Elite Gen 5 Chipset Review — Specifications and Benchmarks — Full specifications
MediaTek Dimensity 7300 Max Chipset Review — Specifications and Benchmarks Qualcomm Snapdragon 8 Elite Gen 5 Chipset Review — Specifications and Benchmarks
التصنيع
Manufacturer MediaTek Qualcomm
Fabrication 4 nm (TSMC) 3 nm (TSMC N3P)
Announced January 2026 (with the Realme 16 Pro launch) — built on the base Dimensity 7300 family (June 2024) 25 September 2025
Availability Available Available
المعالج المركزي
CPU cores 8 cores 8 cores
Core configuration 4× Cortex-A78 + 4× Cortex-A55 2× Oryon Gen 3 Prime at 4.6 GHz + 6× Oryon Gen 3 Performance at 3.62 GHz — no separate efficiency cores
Max clock 2.5 GHz (most sources) — some reviews cited 2.8 GHz, and the difference is not officially confirmed 4.6 GHz
Architecture ARMv8.2-A, 64-bit ARMv9, 64-bit
الرسوميات والذكاء الاصطناعي
GPU Mali-G615 MC2 Adreno 840
GPU clock No specific official figure from MediaTek No exact figure announced by Qualcomm
NPU MediaTek APU 655 Hexagon NPU (37% faster than the previous generation, supports agentic AI and the Qualcomm Sensing Hub)
AI performance No specific figure announced by the company ~100 TOPS approximately (a not fully confirmed estimate, versus 40–45 TOPS in the previous generation)
الذاكرة والاتصال
Supported RAM LPDDR4X LPDDR5X
Max RAM No exact official figure 5300 MHz (bandwidth up to 84.8 GB/s)
Supported storage UFS 3.1 UFS 4.1
Modem Integrated multi-mode 5G (2G through 5G), theoretical download up to 3.27 Gbps Snapdragon X85, theoretical download up to 12.5 Gbps and upload up to 3.7 Gbps
5G Yes Yes
Wi-Fi Wi-Fi 6 Wi-Fi 7 (power savings of up to 40%)
Bluetooth 5.4 6.0
نتائج الاختبارات
AnTuTu ~983,589 ~4,033,382 (with some independent tests at ~3.7 million and above)
Geekbench single-core ~998 – 1003 Roughly matches the Apple A19 Pro (no unified precise official figures published)
Geekbench multi-core ~2869 – 2881 Beats the Apple A19 Pro by up to 21% in independent tests
مميزات إضافية
Key features Excellent thermal stability (~99% consistency in long tests), camera support up to 200 MP, 4K HDR video The first chip with the professional APV video codec, cameras up to 320 MP, 4K@120fps video and 1080p@480fps slow motion, display support up to 240Hz (QHD+) or 4K@120Hz, and full Unreal Engine 5, ray tracing and mesh shading support
Phones using it Realme 16 Pro 5G (January 2026) Xiaomi 17/17 Pro/17 Pro Max, OnePlus 15, iQOO 15, Honor Magic V6, Oppo Find X9 Ultra, Oppo Find N6, Vivo X300 Ultra/Pro, RedMagic 11 Pro/11S Pro, Realme GT8 Pro, Samsung Galaxy S26 (expected early 2026)

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