MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks
There are 8 key differences between MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks and Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks.
ميديا تيك (MediaTek)
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
7.5
Key differences
| MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | MediaTek | Qualcomm |
| Fabrication | 4 nm (TSMC N4P) | 4 nm (Samsung) |
| Announced | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro | 2 September 2024 (without an official press release) |
| Core configuration | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores | 4× Cortex-A78 at 2.4 GHz + 4× Cortex-A55 at 1.8 GHz |
| Max clock | 3.4 GHz | 2.4 GHz |
| Architecture | ARMv9.2-A, 64-bit | ARMv8.2-A, 64-bit |
| GPU | Mali-G720 MC8 | Adreno 710 |
| GPU clock | ~1300–1500 MHz (slight variation between sources) | No exact figure announced by Qualcomm |
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.
- +An all-big-core design that delivers very strong processing performance
- +Top-tier LPDDR5X memory and UFS 4.1 storage
- +Advanced generative AI support via the NPU 880
- −Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
- −Less consistent performance during long gaming sessions
- −Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks
A dependable, practical mid-range chip for everyday use with modern 5G connectivity. Despite the name it is not a real performance leap over the previous generation, so pick a device with good memory and storage to get the most out of it.
- +Modern 5G with mmWave, plus Wi-Fi 6E
- +Good camera support up to 200MP and 4K HDR video
- +Smooth performance in everyday tasks and light to mid-weight games
- −Only a marginal step up from the previous Snapdragon 6 Gen 1
- −The Adreno 710 GPU is completely unchanged from the previous generation
- −Performance varies widely with the device design (up to a 200,000-point AnTuTu spread)
Full specifications
| MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 3 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| التصنيع | ||
| Manufacturer | MediaTek | Qualcomm |
| Fabrication | 4 nm (TSMC N4P) | 4 nm (Samsung) |
| Announced | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro | 2 September 2024 (without an official press release) |
| Availability | Available | Available |
| المعالج المركزي | ||
| CPU cores | 8 cores | 8 cores |
| Core configuration | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores | 4× Cortex-A78 at 2.4 GHz + 4× Cortex-A55 at 1.8 GHz |
| Max clock | 3.4 GHz | 2.4 GHz |
| Architecture | ARMv9.2-A, 64-bit | ARMv8.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | ||
| GPU | Mali-G720 MC8 | Adreno 710 |
| GPU clock | ~1300–1500 MHz (slight variation between sources) | No exact figure announced by Qualcomm |
| NPU | MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation) | Qualcomm AI Engine (Hexagon NPU) — 20% better at tasks such as noise cancellation and activity tracking |
| AI performance | No specific figure announced by MediaTek | Not officially announced by Qualcomm |
| الذاكرة والاتصال | ||
| Supported RAM | LPDDR5X | LPDDR4X / LPDDR5 |
| Max RAM | Up to 9600 Mbps | 3200 MHz (up to 12 GB) |
| Supported storage | UFS 4.1 | UFS 3.1 (some devices may use UFS 2.2) |
| Modem | Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation | Integrated 5G (with mmWave), theoretical download up to 2.9 Gbps |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 6E | Wi-Fi 6E |
| Bluetooth | 5.4 | 5.2 |
| نتائج الاختبارات | ||
| AnTuTu | ~2,136,906 | ~840,643–868,311 (with some devices as low as ~620,000 depending on the design) |
| Geekbench single-core | ~1,708 – 1,725 | ~1,015 – 1,021 |
| Geekbench multi-core | ~6,297 – 6,860 | ~2,910 – 2,920 |
| مميزات إضافية | ||
| Key features | Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving | Camera support up to 200 MP, 4K HDR video at 30fps, selected Snapdragon Elite Gaming features (VRS, Game Color Plus, Game Quick Touch), Quick Charge 4+ support |
| Phones using it | Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5 | Samsung Galaxy A36, Xiaomi Redmi Note 15 5G, Poco M8 5G, Sony Xperia 10 VII, Motorola Moto G75 |
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